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package thickness

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  • Package testing — Military shipping container being drop tested Testing …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • List of electronics package dimensions — Surface mount dimension reference = C Clearance between IC body and PCB H Total Height T Lead Thickness L Total Carrier Length LW Lead Width LL Lead Length P Pitch WB IC Body Width WL Lead to Lead Width Through pin dimension reference C Clearance …   Wikipedia

  • Cushioning — Package cushioning is used to help protect fragile items during shipment. It is common for a transport package to be dropped, kicked, and impacted: These events may produce potentially damaging shocks. Transportation vibration from conveyors,… …   Wikipedia

  • textile — /teks tuyl, til/, n. 1. any cloth or goods produced by weaving, knitting, or felting. 2. a material, as a fiber or yarn, used in or suitable for weaving: Glass can be used as a textile. adj. 3. woven or capable of being woven: textile fabrics. 4 …   Universalium

  • Crystal oscillator — A miniature 4 MHz quartz crystal enclosed in a hermetically sealed HC 49/US package, used as the resonator in a crystal oscillator. A crystal oscillator is an electronic oscillator circuit that uses the mechanical resonance of a vibrating crystal …   Wikipedia

  • Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

  • Business and Industry Review — ▪ 1999 Introduction Overview        Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… …   Universalium

  • Software tools for molecular microscopy — There are a large number of software tools or software applications that have been specifically developed for the field sometimes referred to as molecular microscopy or cryo electron microscopy or cryoEM. Several special issues of the Journal of… …   Wikipedia

  • materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …   Universalium

  • Small-outline integrated circuit — A small outline integrated circuit (SOIC) is a surface mounted integrated circuit (IC) package which occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same… …   Wikipedia

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